A few days ago, AI industrial engineering platform Action Yuan announced the launch of a new generation of intelligent motion control solutions for wafer handling robots, through the integration of big data models, digital twins, and artificial intelligence technology, the formation of a highly integrated solution, not only greatly simplifies the customer’s whole process of moving parts selection and testing. Moreover, the key performance of the wafer handling robot has been upgraded step by step.

As we all know, wafers are the core raw materials of semiconductor chips and need to be transferred between multiple production processes such as film making, oxidation, diffusion, photographic plate making and photolithography. In the whole process, the wafer handling robot bears the heavy load of transportation of this delicate part of the wafer, which is usually composed of the base, the robot arm, the tray, and a number of axes such as front and back, rotation, pitching, and up and down. The stability and moving speed of the end become the key performance indicators, which directly affect the product yield and production efficiency.

Because of this, wafer handling robot manufacturing enterprises often need to spend a lot of time and resources on the various moving parts of the robot arm joint module to repeatedly select, adapt and debug, in order to achieve the ideal overall

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performance requirements.

The intelligent motion control solution created by the mobile unit for the wafer handling robot relies on the unique AI industrial engineering platform to model the mobile unit intelligent drive, torque motor, and encoder and other related motion units, and completes the engineering process of selection, adaptation, and testing on the platform. Match and validate the complete set of solutions that best meet the customer’s requirements. Compared with the traditional model, the mobile AI industrial engineering platform not only gives the “optimal solution” efficiently in the comprehensive performance, but also greatly simplifies the customer selection, wiring, debugging, and maintenance work, helping engineers to free themselves from cumbersome and time-consuming tasks, and concentrate their limited energy and time on the core work such as the research and development of their own equipment.

After the actual test verification on the customer’s equipment, the wafer handling robot driven by the mobile intelligent motion control solution, at the operating speed of 2 meters/second, the position error after place is less than plus or minus 200 pulses, and the setting time is less than 100 milliseconds, the key performance has reached a new level. Show a stronger market competitiveness, so that end users to achieve more stable, precise and efficient wafer processing operations.

For the mobile unit, all this is just an application of the AI industrial engineering platform. At present, the mobile unit intelligent motion control solution built based on the platform has been stably applied to semiconductor, 3C, collaborative robots, medical robots, AGV, power tools, new energy and other fields. With the advent of Industry 4.0 era, mobile AI industrial engineering platform will continue to evolve and improve, through the use of a new technology paradigm, fundamentally restructure the demand, design, selection, development, testing, verification and operation of engineering processes, thereby greatly reducing development costs, improve product launch efficiency, and thus build a new set of industrial ecosystem. Promote the innovation and speed up of the entire industrial process, and create extraordinary value beyond human reach.