As one of the national strategic industries, semiconductor has the characteristics of high integration and high precision. In the industry technology upgrade, the acceleration of domestic substitution and national industrial policies, the semiconductor industry is enjoying a golden development period, the market size is gradually expanding. However, because the semiconductor industry has a very high threshold and barriers, enterprises in the industrial chain face many challenges.

The production process of semiconductor industry is relatively complex, including crystal manufacturing, mid-term packaging and integration, post-assembly and packaging, transportation and so on. It has the characteristics of wide downstream application, complex production technical process, diverse product types and rapid technological update. How to improve production efficiency and product quality in the process of semiconductor chip manufacturing is an urgent problem for the semiconductor industry to deal with.

In the context of digital transformation and intelligent manufacturing, automated inspection can reduce labor costs and significantly improve the quality of finished products. It can also avoid material waste while increasing output, which can help the intelligent development of production in key industries such as semiconductors.

As a global leader in 3D scanning and on-line inspection, LMI has a strong focus on the development of the semiconductor industry, providing accurate 3D online scanning and inspection for all stages of the semiconductor manufacturing process, helping to upgrade the industry. Typical applications include wafer sorting, wafer size and defect detection, BGA detection, defect detection in lead welding, size measurement during ball burning at solder joints, size and defect measurement after packaging, and so on.

Detection problem, height can’t be measured?
In this application, the measured object is a gold wire with a diameter of 30 microns, and its height needs to be detected. One of the difficulties is that the gold wire has a large tilt Angle and cannot be measured near the end of the welding surface. Secondly, the welding direction of the gold wire is inconsistent, which further increases the difficulty of detection.

Faced with these detection difficulties, if we use a traditional 2D camera, we cannot obtain the measured height. Using other traditional detection methods, time consuming, low detection efficiency, difficult to achieve automation and standardization. And the accuracy is far from enough, the generated image effect is not good, can not meet the customer’s detection requirements.

Hit the pain point, Gocator Solutions

To address these challenges, customers used LMI’s Gocator 5504 3D smart line confocal sensor for semiconductor inspection.

The scanning rate is up to 16kHz, the x-direction resolution is up to 2.5 microns, and the Z-direction repeatability is up to 0.05 microns. It can scan the top region of the gold line with ultra-high precision to obtain high quality images and perform height detection online. At the same time, the Gocator 5500 series sensors provide high Angle compatibility.