Congatl, a leading provider of embedded and edge computing technologies, welcomes the release of the revised version 2.2 of the COM-HPC Carrier Design Guide, which adds product specifications and directions for modular design layouts based on the 95 mm x70 mm COM-HPC Mini specification for developers. Published by PICMG, a standards association organization, this guide provides 8I74T400400.010-1 embedded system developers with a comprehensive guide to COM-HPC Mini carrier design, covering all the new features and interfaces implemented in the latest COM-HPC specification update. The release of this new guidance is absolutely critical to the embedded computing space, as high performance design requires it to migrate existing COM Express designs to the COM-HPC Mini specification (COM HPC Specification 1.2), which was officially adopted in October 2023.

COM-HPC Mini offers the most interface pins of any Mini specification standard to date, with a total of 400, and supports the latest high-speed interfaces, including PCIe 4.0 / PCIe 5.0, 10Gbit/s Ethernet, USB 4.0, lightning interfaces, and more. With a maximum input power of 76 watts, which provides ample margin for high-performance multi-core processors, Congardt has developed the conga-HPC/mRLP family of products based on the COM-HPC Mini specification with 13th generation Intel ® Core ™ processors (codenamed “Raptor Lake-P”). Up to 14 cores and support for firmware integrated virtualization technology (Hypervisor) to perform parallel tasks in non-responsive virtual machines, facilitating system integration.

8I74T400400.010-1

The changes in COM-HPC design principles have had an impact on the total height of the module and heat sink, and the height of the COM-HPC Mini design has been reduced by 5 mm. As a result, a minimum mounting height of 19 mm is now required instead of the 24 mm of other COM-HPC specifications. This makes very flat designs possible for applications such as mobile handheld devices or 8I74T400400.010-1 HMI PCS. To meet height limitations, the COM-HPC Mini module uses surface mount memory, which makes the COM-HPC Mini module more robust, as the welded memory not only provides greater shock and vibration resistance, but also enables efficient heat dissipation by direct heat transfer to the heat sink.

Customers who want support in implementing the details of the design guidelines can obtain a sample of the layout from Congatet and attend a design training course. Congatet assists in component selection and provides signal integrity simulation and PCB layout inspection services to detect problems early. Congatet also offers an engineering support option to quickly deliver the first prototypes.