Digital image correlation (DIC) technology analyzes the deformation of objects by comparing the pixel displacement between two or more images, and obtains the 3D displacement field, 3D strain field and 3D deformation field data through 3D reconstruction and digital image correlation algorithm.

DIC test technology is to capture the feature points on the sample surface and calculate the position of the feature points to calculate the deformation information of the sample surface. DIC testing technology can be used to study and analyze the evolution of full-field strain of the sample during the loading process, analyze the strain distribution in different regions of the sample during the loading process, and analyze the influence of the arrangement of strong and weak structures on the deformation and failure of the sample.

SPDSI13 XTDIC three-dimensional full-field strain measurement system, based on digital image correlation technology (DIC) and marker tracking measurement technology, provides reliable and accurate measurement data for product development and testing, which can be used for mechanical property testing of materials, fatigue, strength, vibration analysis and other mechanical behavior characterization.

1, optical device DIC full-field deformation test

In the production process of optical devices, in addition to the repeated simulation and processing of optical components to reduce imaging or optical path errors, the assembly process is also a key link that directly affects the performance and accuracy of the system.

In the process of mechanical installation of optical devices, the error caused by vibration and deformation of optical devices will directly affect the precision index and performance of products, so it is very important to measure the displacement and vibration of optical devices in the process of assembly. XTDIC three-dimensional full-field strain measurement system has prominent advantages in full-field non-contact displacement vibration detection, which can monitor the position and process of error in the actual production and installation process, so that the accuracy index can be optimized during the installation process.

SPDSI13

DIC test process

The digital image correlation method (DIC) tracks the deformation process of the speckle pattern on the surface of the object and calculates the change of the gray value of the speckle region, so as to obtain the deformation and strain data of the surface of the object.

SPDSI13 As an optical device processing product, it is not practical to spray speckle paint on the surface of the measured object, and Xinto 3D technical engineers use the way of sticking to dynamically monitor the position where displacement or vibration may occur.

DIC displacement measuring equipment was set up

The DIC technology test experiment process is divided into two parts to measure whether the plate has relative displacement or vibration during the installation of optical devices; Measure the Angle and position changes of components such as mirrors during actual installation.

DIC test data analysis

DIC test technology can quickly analyze the offset and vibration of optical components in the assembly process, and track the mechanical characteristics of parts in real time, so as to realize quantitative test verification and adjust the assembly process and plan.

As shown in the figure above, the XTDIC three-dimensional full-field strain measurement system can first monitor and measure the displacement and distance of key edge points during optical device assembly, and the actual installation error is about 0.01 micron.

As shown in the figure above, the XTDIC three-dimensional full-field strain measurement system mainly monitors the Angle changes generated by the mirror plane and the base plane during the installation of the reflector in the optical device, and the measurement error value is about 0.1°.