Kongat, a leading supplier of embedded and edge computing technologies, will show its series of computer module (COM) products and various customer system designs at the Shanghai International Embedded Exhibition (Booth No. 441) held in Hall 3 of Shanghai World Expo Exhibition Hall. The main innovative highlights include Kongat’s new aReady Strategy, modules based on the all-new Intel Core Ultra processor and integrated with AI functionality, as well as other products based on innovative low-power and high-performance x86 processor technology that have made their debut. We will focus on showcasing modular solutions that can improve performance and energy efficiency, and integrate advanced Internet of Things (IIoT) and security features. These are aReady The COM solution will significantly improve the application readiness of computer modules (COM) by promoting efficient and reliable development of modern, multifunctional, and fully connected embedded and industrial IoT devices, thereby distinguishing Kangjiate’s products from other procurement options.

Lin Meihui, Sales Director of Kongat China, explained, “The industrial Internet of Things poses significant challenges for original equipment manufacturers (OEMs), and as a leading supplier of computer modules, we meet these challenges by deeply expanding the functionality of COM HPC, COM Express, SMARC, and Qseven modules.”. For example, modular virtualization technology and industrial IoT capabilities enable solution providers to easily add functionality to their applications without the need for self-development or integration. We will demonstrate how our latest aReady strategy provides added value to OEM customers

Highlight: High performance COM-HPC ecosystem

Kongat will showcase the complete product ecosystem of COM HPC modules, including the new COM-HPC Mini size. KONKET’s COM-HPC Mini module uses the 13th generation Intel Core processor (code named Raptor Lake), which represents an important milestone of high-end embedded computing and edge computing at the client level. Kongit’s COM-HPC product ecosystem is composed of modules, powerful cooling solutions and carrier plates. It demonstrates performance through modular edge computing and fanless cooling edge server design. Now, all Kongat COM-HPC modules also support aReady COM solution.

High performance server module product ecosystem

Based on COM Express Type 7 and COM-HPC server modules, Kongat’s high-performance server module product ecosystem has been optimized for the highest bandwidth and performance requirements of powerful edge servers. These modules are designed to support a wide range of industrial needs, including workload consolidation servers for automation, robotics, and medical backend imaging, to robust outdoor servers for utilities and critical infrastructure. It can also meet the advanced needs of autonomous vehicle and video infrastructure in terms of safety and security. Another basic suite of product ecosystems is high-performance cooling, including both rugged and fanless cooling options to ensure reliable operation in harsh environments. In addition, the multifunctional carrier simplifies the integration process, making it easier for developers to design and deploy these solutions in various applications.

Edge artificial intelligence upgrade

In addition, visitors can also see the latest series of AI acceleration modules, including the new COM Express Compact module based on the Intel Core Ultra processor (codenamed Meteor Lake). These new modules support a unique combination of heterogeneous computing engines, making them ideal for running demanding AI workloads at the edge.

Kongat’s conga-SA8 SMARC module is only the size of a credit card, setting a new performance benchmark for future oriented industrial edge computing and powerful virtualization. Based on the Intel Inspiron x7000RE series processor (codenamed Amston Lake) and Intel Core i3 processor, it provides twice the number of cores compared to its predecessor, but with the same power consumption. The target application field is an intelligent factory application that requires high-performance real-time computing with strong AI capabilities. For example, detection systems, fixed robotic arms, and autonomous mobile robots (AMR).

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