LGA: Land Grid Array package.

This technology was first applied to Intel processors, because this packaging technology compared to the previous “metal contact package” has many advantages, so it quickly became popular.

With the continuous change of market demand, the use of LGA packaging technology on a single chip can no longer meet the demand, so a variety of chips and devices are packaged together through LGA modules. For example, the core board of Mill Electronics LGA package shared with you before.

REM615E_1G At present, Mill Electronics has made the core board of LGA package based on a number of MCU/MPU:

There are many manufacturers on the market that do similar LGA packaging core boards, but the core board of Mill Electronics LGA packaging is still very characteristic, and it can be said that it has achieved “innovative design” :

•LCC/LGA package design: more stable and reliable signal connection, better vibration resistance, easy to mass produce batch patches.

• Shield design: anti-signal interference and anti-dust, while supporting customized LOGO, enhance customer brand value.

Compact design: Small size, flexible design, suitable for all sizes of products (especially structurally limited products).

The R & D, design and management capabilities of Mir Electronics are in line with the strict standards of large enterprises, and can be said to be leading the industry.

At the same time, the testing capability of Meer Electronics has achieved a leading level, and each parameter can withstand rigorous testing.

For now, there is no one on the market that can achieve anti-interference, dust, small size and many other excellent characteristics of the LGA package core board, it can be said that Mir Electronics is unique.

In fact, some netizens have found that the mill electronic board is still very recognizable:

REM615E_1G At present, Mir Electronics has made core boards based on MCU/MPU of many manufacturers such as Renesas, ST, TI, NXP, Whole Zhi, Core Chi, and Ruixin Micro, with more categories and models:

Case: MYC-LR3568 core board We take MYC-LR3568 core board as an example, in the size of 43mm*45mm*3.85mm board card integrated RK3568J (B2), LPDDR4, eMMC, E2PROM, PMIC power supply circuit.

LGA Patch package, 12-layer high density PCB design, soldered to the bottom plate in the form of SMD patch, pin LGA patch package. The board adopts 12-layer high density PCB design, gold-settling process production, independent grounding signal layer, lead-free.

MYC-LR3568 domestic core board and development board through a series of software and hardware tests, to ensure stable product performance: key signal quality test, high and low temperature test, software pressure test, 24 hours troup-free operation, adapt to harsh industrial environment.