The LAM 810-099175-012 is a high-performance semiconductor controller module designed specifically for the semiconductor industry to meet the industry’s stringent requirements for precise control and high reliability. The module combines advanced semiconductor technology and control algorithm, and can monitor and adjust the operating state of semiconductor equipment in real time by using high-precision sensors and advanced control algorithms to ensure accurate control and stable operation of the equipment. It not only maintains excellent performance in harsh working environments, such as high temperature, low temperature or high humidity conditions, but also supports a variety of communication protocols and interfaces to facilitate connection and data exchange with other devices or systems.

In addition, the 810-099175-012 module has self-protection functions, including overcurrent, overvoltage, overheating and other protection mechanisms to ensure that the power supply can be automatically cut off or other protective measures can be taken in abnormal circumstances to prevent equipment damage and safety accidents. It uses high-quality components and manufacturing processes, and goes through strict quality control and testing to ensure the stability and reliability of the modules. At the same time, the module has excellent heat dissipation performance, which effectively extends the service life of the module.

810-099175-012

LAM 810-099175-012 Semiconductor controller module is widely used in semiconductor manufacturing, packaging and testing, equipment control and other fields, to help enterprises achieve accurate control of semiconductor equipment, improve production efficiency, reduce energy consumption and cost, and provide strong support for the development of semiconductor industry. Its core components include IGBT (insulated gate bipolar transistor) and FWD (continuous current diode chip), which combine the working principles of MOSFET and GTR to achieve efficient power control and conversion, suitable for converter systems with DC voltages of 600V and above.

It is worth noting that in addition to its application in semiconductor manufacturing, the module is also used as a PCB board component of the etcher to control the plasma etching process in the VIOP stage of the etcher. According to SAUL ELECTRIC, the LAM 810-099175-012 is a printed circuit board (PCB) for the VIOP Phase III component in LAM Research’s semiconductor manufacturing equipment. It is part of VIOP (Via Isolation Oxide Process)