Description
[overview] : 810-800081-022 LAM VME backplane PCB
Basic details |
Origin: USA |
Brand Name:LAM |
Model number:810-800081-022 |
Product Name:810-800081-022 |
Description: 810-800081-022 LAM VME backplane PCB |
Weight :2.7 kg |
Size: 5.1cm x 40.6cm x 25.4cm |
Continuous power off: 4.5 kW |
Warranty: 1 year |
Packaging: 100% original |
Shipping terms: DHL, fedex, UPS, TNT |
Payment method: Telegraphic transfer Western Union |
Brand:LAM |
810-800081-022 LAM VME backplane PCB
VPX architecture is developed based on VME bus technology. It is an international standard bus architecture introduced and maintained by VITA Association. Based on the analysis and design of plate selection, laminated structure, key signal lines and PCB process, the PCB signal integrity design scheme of VPX chassis backplane is proposed.
VPX architecture is the current mainstream modular, universal, open chassis architecture, based on the development of VME bus technology, it is an international standard bus architecture launched and maintained by VITA association. Based on the design concept of “function modularization, integration bus, and test automation”, the basic platform creates a convenient and easy-to-use unified integration architecture, which can be configured on demand, stacked and expanded. The backplane is the basis for the interconnection of all functional modules in the basic platform. The quality of signals plays a decisive role in the stability of the VPX chassis. Therefore, the integrity of PCB signals on the backplane is the key point in the design of the basic platform. In order to solve the signal integrity problems of the backplane such as reflection, crosstalk and power interference, the backplane of the chassis has been carefully designed in the aspects of plate selection, laminated structure, key signal lines and PCB process, and passed the signal integrity simulation and functional performance test.
PCB board and laminated structure is an important element of signal integrity. The backplane of the chassis adopts FR4-TG170 plate, which has higher glass transition temperature and better fire resistance than FR4-TG130. Besides, the plate with dielectric constant less than 4.4 is selected by the designated supplier to reduce the energy transferred when crosstalk occurs. The thickness of the back plate is 5.4mm, and the cost and processing difficulty are considered comprehensively while the quality of signal routing is given priority.
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