Description
Product details:
LAM Research 810-034803-002 Assy PCB DIP BreakoutAPMU
Key words:810-034803-002
Net weight (Kg) : 1.26Kg
Condition: 100% original
Warranty: 1 year
Packaging: 100% original
Delivery time: TNT, DHL, FEDEX, EMS, UPS
Time of payment: Telegraphic transfer
Delivery time: 3-5 days
LAM Research 810-034803-002 Assy PCB DIP BreakoutAPMU. To obtain the best performance of electronic circuits, component layout and wire layout are very important. In order to design good quality, low cost PCB. The following general principles should be followed:
layout
First, consider the PCB size. PCB size is too large, printing line is long, impedance increases, anti-noise ability decreases, the cost also increases; Too small, the heat dissipation is not good, and the adjacent lines are susceptible to interference. After the PCB size is determined, the location of special components is determined. Finally, according to the functional unit of the circuit, the layout of all components of the circuit.
LAM Research 810-034803-002 Assy PCB DIP BreakoutAPMU
According to the upstream and downstream of the industrial chain, it can be divided into raw materials, copper clad plates, printed circuit boards, electronic product applications, etc., and the relationship is simple as follows:
Glass fiber cloth: Glass fiber cloth is one of the raw materials of copper clad plate, made of glass fiber yarn textile, accounting for about 40% of the cost of copper clad plate (thick plate) or 25% (sheet). Glass fiber yarn is calcined into liquid by silica sand and other raw materials in the kiln. It is drawn into very fine glass fiber through a very fine alloy nozzle. Then hundreds of glass fiber are twisted into glass fiber yarn. Kiln construction investment is huge, generally need hundreds of millions of funds, and once the ignition must be 24 hours uninterrupted production, the cost of entry and exit is huge.
Copper foil: Copper foil is the raw material accounting for the largest proportion of the cost of copper clad plate, accounting for about 30% (thick plate) or 50% (sheet) of the cost of copper clad plate, so the price rise of copper is the main driving force of the price rise of copper clad plate.
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